公开(公告)号：US20220341967A1

公开(公告)日：2022-10-27

申请号：US17498820

申请日：2021-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEHOON PARK

IPC: G01R1/073 ,  G01R31/28

Abstract: A probe card includes a sub-board, having a heating layer, connected to a probe pin. A main board is connected to the sub-board and includes a first output terminal configured to output first power received from a first power supply to the heating layer in a first mode. A power converter is configured to lower a first voltage corresponding to residual power received from the first power supply to a second voltage and output the residual power in a second mode. A second output terminal is configured to receive the residual power from the power converter and second power from a second power supply and output third power including the residual power and the second power to a device under test in the second mode. A first switch unit is connected to the first power supply, the first output terminal, and the power converter.

公开(公告)号：US20220308088A1

公开(公告)日：2022-09-29

申请号：US17524841

申请日：2021-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG HOON LEE ,  GYUYEOL KIM ,  YU-KYUM KIM ,  HANJIK NAM ,  SEHOON PARK ,  YOUNG JUN PARK ,  SEUNGWON JEONG ,  WOOJUN CHOI

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.