公开(公告)号：US20140283886A1

公开(公告)日：2014-09-25

申请号：US14298304

申请日：2014-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Jhin CHO ,  Kun-Tack LEE ,  Hyo-San LEE ,  Young-Hoo KIM ,  Jung-Won LEE ,  Sang-Won BAE ,  Jung-Min HO

IPC: H01L21/67

CPC classification number: H01L21/67023 ,  B08B7/0021 ,  H01L21/0206 ,  H01L21/02104 ,  H01L21/31111 ,  H01L22/00 ,  H01L22/26 ,  H01L27/10852 ,  H01L28/90

Abstract: In a supercritical fluid method a supercritical fluid is supplied into a process chamber. The supercritical fluid is discharged from the process chamber as a supercritical fluid process proceeds. A concentration of a target material included in the supercritical fluid discharged from the process chamber is detected during the supercritical fluid process. An end point of the supercritical fluid process may be determined based on a detected concentration of the target material.

Abstract translation: 在超临界流体法中，将超临界流体供应到处理室中。 当超临界流体处理进行时，超临界流体从处理室排出。 在超临界流体处理中检测从处理室排出的超临界流体中包含的目标材料的浓度。 超临界流体处理的终点可以基于检测到的目标材料的浓度来确定。