公开(公告)号：US20240188218A1

公开(公告)日：2024-06-06

申请号：US18438124

申请日：2024-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonglak CHO ,  Joohan KIM ,  Juho KIM ,  Min PARK ,  Eunsoo PARK ,  Insun AN ,  Byungwoo LEE ,  Sangtae LEE ,  Haejin LEE

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/144 ,  H05K3/284 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10545

Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.