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公开(公告)号:US20220117086A1
公开(公告)日:2022-04-14
申请号:US17560689
申请日:2021-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyujin KWAK , Jinwoo PARK , Yonglak CHO , Jiwoo LEE
Abstract: According to certain embodiments, an electronic device comprises: a housing including a first support member; a cover member coupled with and facing the first support member; a second support member coupled with and facing the first support member; a printed circuit board assembly disposed to face the first support member, the printed circuit board assembly having a part disposed between the first support member and the cover member and another part disposed between the first support member and the second support member; wherein the printed circuit board assembly comprises: a first circuit board including a first part disposed between the first support member and the cover member, and a second part disposed between the first support member and the second support member; a second circuit board disposed to at least partially face the first part and disposed between the first circuit board and the cover member; and an interposer board disposed to correspond to at least a part of an edge of the second circuit board and coupling the second circuit board with the first circuit board, and wherein the second support member biases a part of the edge of the second circuit board.
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公开(公告)号:US20240188218A1
公开(公告)日:2024-06-06
申请号:US18438124
申请日:2024-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yonglak CHO , Joohan KIM , Juho KIM , Min PARK , Eunsoo PARK , Insun AN , Byungwoo LEE , Sangtae LEE , Haejin LEE
CPC classification number: H05K1/144 , H05K3/284 , H05K1/181 , H05K2201/042 , H05K2201/09063 , H05K2201/10378 , H05K2201/10545
Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.
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公开(公告)号:US20240094784A1
公开(公告)日:2024-03-21
申请号:US18470716
申请日:2023-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minhong DO , Yongwoon KIM , Eunsoo PARK , Jaebum BAE , Yonglak CHO
IPC: G06F1/16
CPC classification number: G06F1/1681
Abstract: According to an embodiment of the disclosure, an electronic device may comprise a housing including a first housing and a second housing configured to rotate relative to the first housing and a hinge module rotatably coupling the first housing and the second housing and received in the housing. The hinge module includes a hinge housing including a receiving space, a spring positioned in the receiving space of the hinge housing, a supporting member including an inclined portion coupled to one end of the spring, and a cam coupled to another end of the spring and configured to transfer force to the spring.
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公开(公告)号:US20230099993A1
公开(公告)日:2023-03-30
申请号:US18077804
申请日:2022-12-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeongsik KIM , Muyeol LEE , Eunsoo PARK , Yonglak CHO , Jiwoo LEE
Abstract: An electronic device includes: a housing; a first camera module disposed in the housing, the first camera module including: a first camera housing; a prism disposed in the first camera housing and configured to refract light received from outside of the electronic device; and an image sensor disposed in the first camera housing and configured to obtain the light through the prism; and an antenna module configured to transmit or receive a signal, wherein at least a portion of the antenna module is disposed on the first camera module.
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公开(公告)号:US20240431016A1
公开(公告)日:2024-12-26
申请号:US18754916
申请日:2024-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joohan KIM , Yonglak CHO , Min PARK
Abstract: According to an embodiment, a printed circuit board (PCB) structure may include: a first PCB; an interposer; a second PCB; and a cover structure including a mounting layer which is connected to the second PCB and includes a base hole, a support layer which is on a surface of the mounting layer that faces away from the second PCB, and a visible layer which is connected to the support layer and includes a material having transparency.
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公开(公告)号:US20230243916A1
公开(公告)日:2023-08-03
申请号:US18297254
申请日:2023-04-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Muyeol LEE , Byungsu LEE , Yonglak CHO , Hyunsuk CHOI
CPC classification number: G01S5/04 , G01S13/0209 , G06F1/1652 , H01Q1/243 , H04M1/0214
Abstract: An electronic device is provided that includes a foldable housing. The foldable housing includes a hinge module, a first housing, and a second housing. The first housing is connected to the hinge module and includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a first antenna supporting a first frequency band. The second housing is connected to the hinge module and includes a third surface facing a third direction, a fourth surface facing a fourth direction opposite to the third direction, and a second antenna supporting the first frequency band, and is folded with the first housing with respect to the hinge module. In the electronic device, in a folded state in which the first surface faces the third surface, the first antenna and the second antenna may be arranged to be spaced apart from each other by half a wavelength corresponding to the first frequency band, and in an unfolded state in which the first direction and the third direction are the same direction, the first antenna and the second antenna may be arranged to be spaced apart from each other by an error range or more, wherein the error range corresponds to the first frequency band.
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公开(公告)号:US20200052428A1
公开(公告)日:2020-02-13
申请号:US16511331
申请日:2019-07-15
Applicant: Samsung Electronics Co., Ltd. , Hyupjinconnector Co., Ltd.
Inventor: Yonglak CHO , Jeongki PARK , Mihyun KIM , Jeongyong LEE , Choonggeun LEE , Dongjin CHUNG , Jangwon HUR , Jiwoo LEE
Abstract: The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.
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