公开(公告)号：US20210057262A1

公开(公告)日：2021-02-25

申请号：US16834132

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Racine Elysia Auxter NASSAU ,  Namil KOO ,  Suhwan PARK ,  Taeheung AHN ,  Sangyeon OH

IPC: H01L21/683 ,  H01L21/687 ,  G01N21/95

Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.

公开(公告)号：US20240167162A1

公开(公告)日：2024-05-23

申请号：US18215916

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihyeong LEE ,  Sangyeon OH ,  Minsung KIM ,  Byeongsang KIM ,  Yihwan KIM ,  Sangchul HAN

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/4581 ,  C23C16/46

Abstract: A substrate processing apparatus includes a chamber providing a space for performing a semiconductor process on a semiconductor substrate, and a substrate stage configured to support the semiconductor substrate. The substrate stage includes a platen having a seating surface to support the semiconductor substrate, the platen having a resistance heater and an RF electrode adjacent to the seating surface, a shaft under the platen, the shaft having a first through hole in a central region and a plurality of second through holes in a peripheral region surrounding the central region, an RF rod spaced apart from an inner wall of the first through hole, the RF rod electrically connected to the RF electrode, and a plurality of heater rods respectively within the plurality of second through holes and electrically connected to the resistance heater.

公开(公告)号：US20240152058A1

公开(公告)日：2024-05-09

申请号：US18337982

申请日：2023-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonki LEE ,  Hyoungsoo KIM ,  Junill RYU ,  Namil KOO ,  Jongmin YOON ,  Suhwan PARK ,  Sangyeon OH ,  Gilgu LEE

IPC: G03F7/00

CPC classification number: G03F7/70341 ,  G03F7/70883

Abstract: An immersion lithographic system may include a wafer stage configured to support a wafer, a projection optical system on the wafer stage and configured to irradiate light toward the wafer, a liquid supply unit configured to supply a liquid between the wafer stage and the projection optical system to form an immersion lens through which the light is transmitted, and a vapor supply unit configured to supply vapors to the immersion lens. The immersion lens and the vapor supply unit may be aligned in a vertical direction.