公开(公告)号：US11323640B2

公开(公告)日：2022-05-03

申请号：US16815186

申请日：2020-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Moo Young Kim ,  Minho Kwon ,  Dongki Min ,  Seonghye Park ,  Eunjik Yi

IPC: H04N5/225 ,  H04N5/347 ,  H04N9/04

Abstract: Systems and methods are described for a tetracell image sensor that performs diamond binning to process image data. An image sensor includes a pixel array and a converting circuit, where the pixel array includes pixel sets arranged in a row direction and a column direction, outputs a first signal generated from a first pixel set of the pixel sets, and outputs a second signal generated from a second pixel set of the pixel sets. The converting circuit performs binning based on the first signal and the second signal to generate a first binning signal. Each of the first pixel set and the second pixel set includes pixel sensors adjacent to each other, and the first pixel set and the second pixel set are located at different rows and different columns.