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1.
公开(公告)号:US20230299111A1
公开(公告)日:2023-09-21
申请号:US18106143
申请日:2023-02-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyeokjong Lee , Minho Kwon , Kyongsoon Cho
IPC: H01L27/146 , H01L21/66 , H01L23/60 , H01L27/02 , H01L25/065
CPC classification number: H01L27/14636 , H01L22/14 , H01L23/60 , H01L27/02 , H01L25/0657
Abstract: A semiconductor device includes: a first semiconductor chip having an upper surface divided into a pixel array region and a connection region, wherein a plurality of pads are disposed in the connection region; and a second semiconductor chip disposed on the first semiconductor chip, wherein the plurality of pads include: a first bonding pad for connection with an external circuit; and a first probing pad adjacent to the first bonding pad and for an electrical die sorting (EDS) test, and wherein the second semiconductor chip includes: a first space overlapping the first bonding pad in a vertical direction and in which at least a portion of an electrostatic discharge protection circuit is formed.
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公开(公告)号:US11323640B2
公开(公告)日:2022-05-03
申请号:US16815186
申请日:2020-03-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Moo Young Kim , Minho Kwon , Dongki Min , Seonghye Park , Eunjik Yi
Abstract: Systems and methods are described for a tetracell image sensor that performs diamond binning to process image data. An image sensor includes a pixel array and a converting circuit, where the pixel array includes pixel sets arranged in a row direction and a column direction, outputs a first signal generated from a first pixel set of the pixel sets, and outputs a second signal generated from a second pixel set of the pixel sets. The converting circuit performs binning based on the first signal and the second signal to generate a first binning signal. Each of the first pixel set and the second pixel set includes pixel sensors adjacent to each other, and the first pixel set and the second pixel set are located at different rows and different columns.
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