公开(公告)号：US12044974B2

公开(公告)日：2024-07-23

申请号：US17569556

申请日：2022-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyojin Yun ,  Seungwon Kim ,  Taeyoung Kim ,  Woojung Park ,  Jinhye Bae ,  Hyunseop Shin ,  Mintae Lee ,  Hoon Han ,  Moonyoung Kim ,  Moonchang Kim ,  Cheolmo Yang ,  Yunseok Choi

IPC: G03F7/42 ,  B08B3/04 ,  C11D3/04 ,  H01L21/02

CPC classification number: G03F7/425 ,  B08B3/04 ,  C11D3/044 ,  H01L21/0206

Abstract: A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

公开(公告)号：US20220350253A1

公开(公告)日：2022-11-03

申请号：US17569556

申请日：2022-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYOJIN YUN ,  Seungwon Kim ,  Taeyoung Kim ,  Woojung Park ,  Jinhye Bae ,  Hyunseop Shin ,  Mintae Lee ,  Hoon Han ,  Moonyoung Kim ,  Moonchang Kim ,  Cheolmo Yang ,  Yunseok Choi

IPC: G03F7/42 ,  B08B3/04 ,  C11D3/04 ,  H01L21/02

Abstract: A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

公开(公告)号：US10199366B2

公开(公告)日：2019-02-05

申请号：US15627536

申请日：2017-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungwon Kim ,  Su-Jin Kwon ,  Junwon Han ,  Hyunwoo Kim ,  Byung Lyul Park

IPC: H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.