公开(公告)号：US20190115944A1

公开(公告)日：2019-04-18

申请号：US16090492

申请日：2017-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-won KIM ,  Jae-heung PARK ,  Sun-ki KIM ,  Woon-hee PARK ,  Dong-jae LEE

IPC: H04B1/3827 ,  B06B1/04 ,  G01H1/04 ,  G01B17/02 ,  H04R1/02 ,  H04R1/04

CPC classification number: H04B1/385 ,  B06B1/04 ,  G01B17/02 ,  G01H1/04 ,  H04B2001/3866 ,  H04R1/026 ,  H04R1/04 ,  H04R2201/023 ,  H04R2499/13

Abstract: An audio apparatus and a control method therefor are provided. The present audio apparatus comprises: a vibration part for providing audio using vibration; a sensing part for sensing one or more of the material and the thickness of an object to which the audio apparatus is attached; a pressure regulation part for regulating the pressure that is applied to the object by the vibration part; and a processor for controlling the pressure regulation part in order to regulate the pressure applied to the object by the vibration part based on one or more of the material and the thickness of the object that is sensed by the sensing part.