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公开(公告)号:US20210013074A1
公开(公告)日:2021-01-14
申请号:US16791564
申请日:2020-02-14
发明人: TAEHYOUNG LEE , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC分类号: H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
摘要: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.