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公开(公告)号：US11538701B2
公开(公告)日：2022-12-27
申请号：US16791564
申请日：2020-02-14
发明人： Taehyoung Lee , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC分类号： H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
摘要： A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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公开(公告)号：US20210013074A1
公开(公告)日：2021-01-14
申请号：US16791564
申请日：2020-02-14
发明人： TAEHYOUNG LEE , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC分类号： H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
摘要： A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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公开(公告)号：US10724967B2
公开(公告)日：2020-07-28
申请号：US16242088
申请日：2019-01-08
发明人： Myung Ho Jung , Young Su Ryu , Sung Chai Kim , Jong Su Kim , Won Guk Seo , Chang Hoon Choi , Jeong Su Ha
IPC分类号： G01N21/00 , G01N21/956 , G06T7/00 , G01N21/95 , H01L21/67 , H01L21/677 , G06T7/11
摘要： An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.
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