公开(公告)号：US20230085764A1

公开(公告)日：2023-03-23

申请号：US18070825

申请日：2022-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyang NA ,  Kicheol BAE ,  Chulwoo PARK

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.

公开(公告)号：US20230371180A1

公开(公告)日：2023-11-16

申请号：US18224929

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yohan MOON ,  Hyoseok NA ,  Taeyang NA ,  Jonghun YOO ,  Seonjun KIM

IPC: H05K1/14 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/144 ,  H05K1/145 ,  H05K3/3457 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10098 ,  H05K2203/0415

Abstract: An electronic device includes: a first circuit board; at least one electronic component module disposed on the first circuit board; one first connection member disposed on the first circuit board; and a second circuit board stacked on the one first connection member, wherein the one electronic component module includes: a third circuit board facing the first circuit board; one first electronic component disposed on the third circuit board; a fourth circuit board facing the second circuit board; one second electronic component disposed on the fourth circuit board; a first contact point disposed on the third circuit board and configured to electrically connect the first circuit board with the third circuit board; and a second contact point disposed on the fourth circuit board and configured to electrically connect the second circuit board with the fourth circuit board.