公开(公告)号：US09558979B2

公开(公告)日：2017-01-31

申请号：US14046469

申请日：2013-10-04

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hwa Seob Choi ,  Yu Sung Jang ,  Tai Young Eum ,  Jee Ho Lee

IPC分类号： B23B31/02 ,  B23B5/34 ,  H01L21/68 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/681 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T279/11 ,  Y10T279/21

摘要： A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.

摘要翻译： 晶片卡盘在其表面上保持晶片，使得晶片的图像可以由由晶片卡盘的表面反射的光形成。 晶片卡盘的表面是具有等于或大于40％的反射率和/或等于或大于90的白度指数值的平坦表面。晶片卡盘可以包括具有纯度相等的含有氧化铝的陶瓷 至95％以上。 晶片卡盘的平坦表面使得照亮晶片卡盘的表面的光被晶片卡盘的表面通过晶片反射。 晶片卡盘可以用于切割晶片的装置，并且由表面反射的光可以用于形成用于识别晶片上的切割线的晶片的图像。