公开(公告)号：US20140203304A1

公开(公告)日：2014-07-24

申请号：US14095445

申请日：2013-12-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Dae-hyun KIM ,  Wan-jong KIM ,  Jung-jin KIM ,  Jung-kyu PARK ,  Kyu-ho JANG

IPC分类号： H01L33/52 ,  H05K7/00 ,  H01L27/15

CPC分类号： B29C45/0046 ,  B29C45/14639 ,  B29C2045/0089 ,  B29C2045/2691 ,  B29L2011/00 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

摘要： Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin molding products, each runner and gate member having a smaller thickness than a thickness of the resin molding products to facilitate cutting thereof.

摘要翻译： 提供一种发光器件封装条，其包括引线框带，在引线框带中注塑成型的多个树脂成型产品，以及形成在相邻树脂成型体之间和端侧的流道和浇口构件 的一条相邻的树脂成型制品，每个浇道和浇口构件的厚度小于树脂模塑制品的厚度，以便切割它们。