公开(公告)号：US20210136966A1

公开(公告)日：2021-05-06

申请号：US16638645

申请日：2018-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Tae JANG ,  Min PARK ,  Byung Hoon LEE ,  Youngchul LEE ,  Changjoon LEE ,  Jiyoung JANG ,  Youngjun MOON ,  Minyoung PARK ,  Jeonggen YOON ,  Won CHOI ,  Siho JANG

IPC: H05K13/04 ,  H01L33/00 ,  H05K13/02

Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

公开(公告)号：US20220367417A1

公开(公告)日：2022-11-17

申请号：US17863695

申请日：2022-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin PARK ,  Sunghawn BAE ,  Won CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10 ,  H01L25/18

Abstract: A semiconductor package includes: a redistribution substrate; a frame including first and second vertical connection conductors, and having a through-hole; first and second semiconductor chips; an encapsulant; a second redistribution structure disposed on the encapsulant, a conductive wire electrically connecting the second semiconductor chip and the second vertical connection conductor; and a vertical connection via penetrating a portion of the encapsulant, and electrically connecting the second redistribution structure and the first vertical connection conductor. The first semiconductor chip is connected to the second vertical connection conductor by the first redistribution structure.

公开(公告)号：US20210375833A1

公开(公告)日：2021-12-02

申请号：US16629768

申请日：2018-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngchul LEE ,  Taesang PARK ,  Kyoree LEE ,  Tackmo LEE ,  Gyun HEO ,  Youngjun MOON ,  Won CHOI

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  H01L25/16

Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.

公开(公告)号：US20240274556A1

公开(公告)日：2024-08-15

申请号：US18481385

申请日：2023-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won CHOI ,  Ji-Yong PARK ,  Bok Sik MYUNG

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/08 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/24 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/08188 ,  H01L2224/13024 ,  H01L2224/24227 ,  H01L2924/381

Abstract: A semiconductor device may include a substrate, a pad on the substrate and connected to an interconnection pattern in the substrate, and a solder resist layer on the substrate, the solder resist layer having an opening exposing the pad. A top surface of the pad having a center region, and a peripheral region surrounding the center region. The center region of the top surface of the pad may be located at a level different from the peripheral region of the top surface of the pad, and a first width of the pad may be constant regardless of a distance from the substrate.

公开(公告)号：US20210257337A1

公开(公告)日：2021-08-19

申请号：US17019616

申请日：2020-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin PARK ,  Sunghawn BAE ,  Won CHOI

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor package includes: a redistribution substrate; a frame including first and second vertical connection conductors, and having a through-hole; first and second semiconductor chips; an encapsulant; a second redistribution structure disposed on the encapsulant, a conductive wire electrically connecting the second semiconductor chip and the second vertical connection conductor; and a vertical connection via penetrating a portion of the encapsulant, and electrically connecting the second redistribution structure and the first vertical connection conductor. The first semiconductor chip is connected to the second vertical connection conductor by the first redistribution structure.