公开(公告)号：US20240234164A1

公开(公告)日：2024-07-11

申请号：US18353293

申请日：2023-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Keun CHO ,  Dong Hoon KWON ,  Ki Hoon JANG

IPC: H01L21/321 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/3212 ,  H01L21/67103 ,  H01L21/67219 ,  H01L21/67248 ,  H01L21/67706

Abstract: A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a temperature controller thermally connected to the caterpillar module.