公开(公告)号：US20240080982A1

公开(公告)日：2024-03-07

申请号：US18372937

申请日：2023-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juho Kim ,  Woochul Park ,  Dongyeol Kwak ,  Juwon Kim ,  Yousok Min ,  Wonbin Jo ,  Sooyong Park

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K2201/042 ,  H05K2201/10378

Abstract: An electronic device includes a housing including a front surface, a rear surface that is opposite to the front surface, and a side surface enclosing an inner space between the front surface and the rear surface, a display that is visually exposed to the outside of the electronic device, and a printed circuit board that is in the inner space. The printed circuit board includes a plurality of circuit boards that are parallel to one another and include electrical elements and one or more interposers that are between the plurality of circuit boards and connecting a pair of circuit boards adjacent to each other in a height direction. The one or more interposers include one or more via holes, a via and one or more interposer through holes.