公开(公告)号：US20240079299A1

公开(公告)日：2024-03-07

申请号：US18125917

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekyung YOO ,  Woohyeong KIM ,  Jinwoo PARK ,  Juhyeon OH ,  Jayeon LEE

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/49811 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/16 ,  H01L2224/16227 ,  H10B80/00

Abstract: A semiconductor package includes a first redistribution wiring layer having a first surface and a second surface opposite to the first surface, the first redistribution wiring layer having protrusions protruding from the first surface and a plurality of first bonding pads provided on the protrusions, a first semiconductor device mounted on the first redistribution wiring layer via conductive bumps, a plurality of conductive structures respectively extending from the first bonding pads around the first semiconductor device, and a second redistribution wiring layer disposed on the conductive structures and electrically connected to the first redistribution wiring layer.