SEMICONDUCTOR PACKAGE
    1.
    发明申请

    公开(公告)号:US20210013152A1

    公开(公告)日:2021-01-14

    申请号:US17032916

    申请日:2020-09-25

    Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

    SEMICONDUCTOR PACKAGE
    2.
    发明公开

    公开(公告)号:US20230170310A1

    公开(公告)日:2023-06-01

    申请号:US18103584

    申请日:2023-01-31

    Abstract: A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.

    SEMICONDUCTOR PACKAGE
    3.
    发明申请

    公开(公告)号:US20220392846A1

    公开(公告)日:2022-12-08

    申请号:US17887557

    申请日:2022-08-15

    Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

    SEMICONDUCTOR PACKAGE
    5.
    发明申请

    公开(公告)号:US20220068835A1

    公开(公告)日:2022-03-03

    申请号:US17212035

    申请日:2021-03-25

    Abstract: A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.

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