公开(公告)号：US20210013152A1

公开(公告)日：2021-01-14

申请号：US17032916

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon OH ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

公开(公告)号：US20230170310A1

公开(公告)日：2023-06-01

申请号：US18103584

申请日：2023-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongwan KIM ,  Kyong Hwan KOH ,  Juhyeon OH ,  Yongkwan LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/49838 ,  H01L21/568 ,  H01L23/49816 ,  H01L2224/16227 ,  H01L24/16

Abstract: A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.

公开(公告)号：US20220392846A1

公开(公告)日：2022-12-08

申请号：US17887557

申请日：2022-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon OH ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

公开(公告)号：US20240079299A1

公开(公告)日：2024-03-07

申请号：US18125917

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekyung YOO ,  Woohyeong KIM ,  Jinwoo PARK ,  Juhyeon OH ,  Jayeon LEE

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/49811 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/16 ,  H01L2224/16227 ,  H10B80/00

Abstract: A semiconductor package includes a first redistribution wiring layer having a first surface and a second surface opposite to the first surface, the first redistribution wiring layer having protrusions protruding from the first surface and a plurality of first bonding pads provided on the protrusions, a first semiconductor device mounted on the first redistribution wiring layer via conductive bumps, a plurality of conductive structures respectively extending from the first bonding pads around the first semiconductor device, and a second redistribution wiring layer disposed on the conductive structures and electrically connected to the first redistribution wiring layer.

公开(公告)号：US20220068835A1

公开(公告)日：2022-03-03

申请号：US17212035

申请日：2021-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongwan KIM ,  Kyong Hwan KOH ,  Juhyeon OH ,  Yongkwan LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package including a substrate including at least one ground pad and a ground pattern; a semiconductor chip on the substrate; and a shield layer on the substrate and covering the semiconductor chip, wherein the shield layer extends onto a bottom surface of the substrate and includes an opening region on the bottom surface of the substrate, a bottom surface of the at least one ground pad is at the bottom surface of the substrate, a side surface of the ground pattern is at a side surface of the substrate, and the shield layer on the bottom surface of the substrate is in contact with the bottom surface of the at least one ground pad and in contact with the side surface of the ground pattern.