公开(公告)号：US20240055395A1

公开(公告)日：2024-02-15

申请号：US18206201

申请日：2023-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Manho LEE ,  Jungmin SEO ,  Kwangseob SHIN ,  Woosin CHOI ,  Junghwan CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H10B80/00

CPC classification number: H01L25/0652 ,  H01L24/49 ,  H10B80/00 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2224/49052 ,  H01L2224/49096

Abstract: A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. The second set of semiconductor dies are on the first set of semiconductor dies. The buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. The second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.