公开(公告)号：US12009277B2

公开(公告)日：2024-06-11

申请号：US17866866

申请日：2022-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Kyu Kim ,  Jung-Ho Park ,  Jong Youn Kim ,  Yeon Ho Jang ,  Jae Gwon Jang

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/16225 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.