公开(公告)号：US20200058569A1

公开(公告)日：2020-02-20

申请号：US16523498

申请日：2019-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Hyun CHO ,  Young Sik HUR ,  Won Wook SO ,  Kyung Hwan KO ,  Yong Ho BAEK ,  Yong Duk LEE

IPC: H01L23/31 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.