公开(公告)号：US20200051933A1

公开(公告)日：2020-02-13

申请号：US16285606

申请日：2019-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoo Rim CHA ,  Joo Hwan JUNG ,  Jung Chul GONG ,  Yong Ho BAEK ,  Young Sik HUR

IPC: H01L23/64 ,  H01L23/498 ,  H01L23/13

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

公开(公告)号：US20200043970A1

公开(公告)日：2020-02-06

申请号：US16598134

申请日：2019-10-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung Chan KIM ,  Yong Ho BAEK

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00 ,  H01L21/683

Abstract: The fan-out sensor package includes: a core member having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole and having a first surface having a sensor region and first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon vias (TSVs) penetrating between the first and second surfaces and electrically connecting the first and second connection pads to each other; an encapsulant covering the core member and the second surface of the IC for a sensor and filling at least portions of the through-hole; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

公开(公告)号：US20200013743A1

公开(公告)日：2020-01-09

申请号：US16287064

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il KIM ,  Yong Ho BAEK ,  Won Wook SO ,  Young Sik HUR

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/04

Abstract: A semiconductor package includes a semiconductor chip including a body, a connection pad, a passivation film, a first connection bump disposed, and a first coating layer; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure including an insulating layer, a redistribution layer, and a connection via. The first connection bump includes a low melting point metal, the redistribution layer and the connection via include a conductive material, and the low melting point metal has a melting point lower than a melting point of the conductive material.

公开(公告)号：US20200235154A1

公开(公告)日：2020-07-23

申请号：US16844717

申请日：2020-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Ho BAEK ,  Jung Hyun CHO ,  Min Keun KIM ,  Young Sik HUR ,  Tae Hee HAN

IPC: H01L27/146 ,  H01L27/32 ,  H01L23/00 ,  G02B5/20 ,  G06K9/00

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

公开(公告)号：US20190273079A1

公开(公告)日：2019-09-05

申请号：US16107302

申请日：2018-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Chul GONG ,  Yong Ho BAEK ,  Young Sik HUR ,  Joo Hwan JUNG ,  Yoo Rim CHA

IPC: H01L27/07 ,  H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L21/56

Abstract: A fan-out semiconductor package module that is easily manufactured includes a first connection member including a wiring layer, a first passive component mounted on the first connection member, a first encapsulation portion encapsulating at least a portion of the first connection member and the first passive component, a semiconductor chip having an active surface with a connection pad disposed thereon and an inactive surface opposing the active surface and disposed in a first through-hole penetrating through the first connection member and the first encapsulation portion, a second encapsulation portion covering at least a portion of the semiconductor chip and encapsulating at least a portion of the first encapsulation portion and the first connection member, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad and the first passive component.

公开(公告)号：US20190287938A1

公开(公告)日：2019-09-19

申请号：US16119913

申请日：2018-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Rok KIM ,  Min Keun KIM ,  Yong Ho BAEK ,  Young Sik HUR ,  Jung Chul GONG

IPC: H01L23/00 ,  H01L23/552

Abstract: A fan-out component package includes: a core member having a through-hole and including wiring layers and one or more connection vias; one or more first electronic components disposed in the through-hole; a first encapsulant covering at least portions of the core member and the first electronic components and filling at least a portion of the through-hole; a connection member disposed on the core member and the first electronic components and including one or more redistribution layers electrically connected to the wiring layers and the first electronic components; one or more second electronic components disposed on the connection member and electrically connected to the redistribution layers; and a second encapsulant disposed on the connection member and encapsulating the second electronic components, wherein an upper surface of the connection member and a lower surface of the second encapsulant are spaced apart from each other by a predetermined interval.

公开(公告)号：US20220059926A1

公开(公告)日：2022-02-24

申请号：US17517874

申请日：2021-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Wook SO ,  Jin Seon PARK ,  Young Sik HUR ,  Jung Chul GONG ,  Yong Ho BAEK

IPC: H01Q1/22 ,  H01Q1/24 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31 ,  H01L23/522

Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

公开(公告)号：US20210327832A1

公开(公告)日：2021-10-21

申请号：US17357542

申请日：2021-06-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoo Rim CHA ,  Joo Hwan JUNG ,  Jung Chul GONG ,  Yong Ho BAEK ,  Young Sik HUR

IPC: H01L23/64 ,  H01L23/13 ,  H01L23/498

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

公开(公告)号：US20200058569A1

公开(公告)日：2020-02-20

申请号：US16523498

申请日：2019-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Hyun CHO ,  Young Sik HUR ,  Won Wook SO ,  Kyung Hwan KO ,  Yong Ho BAEK ,  Yong Duk LEE

IPC: H01L23/31 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

公开(公告)号：US20190279950A1

公开(公告)日：2019-09-12

申请号：US16009732

申请日：2018-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il KIM ,  Dae Kwon JUNG ,  Young Sik HUR ,  Yong Ho BAEK

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.