公开(公告)号：US10330722B2

公开(公告)日：2019-06-25

申请号：US15670379

申请日：2017-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min-woo Kim ,  Yong-dae Ha ,  Chang-ho Lee ,  Seul-ki Han

IPC: G01R31/00 ,  G01R31/26 ,  G01R31/28

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.