公开(公告)号：US11956890B2

公开(公告)日：2024-04-09

申请号：US17720364

申请日：2022-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunho Lee ,  Yoojeong Kwon ,  Kyoungsun Kim ,  Dongyeop Kim ,  Sungjoo Park

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/11 ,  H05K1/18 ,  G11C11/401 ,  G11C16/04

CPC classification number: H05K1/0245 ,  H01P3/088 ,  H05K1/115 ,  H05K1/181 ,  G11C11/401 ,  G11C16/0483 ,  H05K2201/10159

Abstract: A circuit board includes a first insulating layer; a first wiring pattern and a second wiring pattern each formed to be side to side with each other on an upper surface of the first insulating layer; a second insulating layer formed on the upper surface of the first insulating layer to cover the first and second wiring patterns; a third wiring pattern formed on an upper surface of the second insulating layer to overlap the first wiring pattern in a vertical direction; a fourth wiring pattern formed on the upper surface of the second insulating layer to overlap the second wiring pattern in the vertical direction; a first via passing through the second insulating layer and connecting the first and fourth wiring patterns; and a second via passing through the second insulating layer and connecting the second and third wiring patterns.