公开(公告)号：US09831380B2

公开(公告)日：2017-11-28

申请号：US14752632

申请日：2015-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Kyu Park ,  Wan Jong Kim ,  Young Geun Jun

IPC: H01L21/48 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L23/495 ,  H01L41/338 ,  H01L33/00 ,  H01L23/00

CPC classification number: H01L33/0095 ,  H01L21/4842 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of manufacturing a semiconductor device package includes: forming a based frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame by separating grooves interposed therebetween, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame; forming a package body in each of the plurality of unit frames to allow a mounting area of each unit frame to be open; removing one of the first connector and second the connector connected to each unit frame; mounting a semiconductor device in the mounting area of the unit frame; and cutting the other of the first connector and second the connector connected to each unit frame and separating, from the base frame, the unit frame in which the package body is formed.