公开(公告)号：US20200259243A1

公开(公告)日：2020-08-13

申请号：US16788925

申请日：2020-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil JEON ,  Namwoo KIM ,  Seongbeom HONG ,  Kyunghoon MOON ,  Yunbum LEE

IPC: H01Q1/24

Abstract: Disclosed is an electronic device including a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the first plate and the second plate, a first antenna structure disposed to be substantially parallel with the second plate in the space, and including a substrate disposed in the space, and at least one antenna element disposed on the substrate to face at least the second plate, a conductive member disposed in the space and spaced apart from the at least one antenna element by a predetermined interval when the second plate is viewed from above.

公开(公告)号：US20230261731A1

公开(公告)日：2023-08-17

申请号：US18308297

申请日：2023-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaegon GHIM ,  Heeyoon KWAK ,  Yunbum LEE ,  Kwan HEO ,  Changhyun HONG

IPC: H04B7/10 ,  H04B7/0404 ,  H04W72/232

CPC classification number: H04B7/10 ,  H04B7/0404 ,  H04W72/232

Abstract: A 5th generation (5G) and/or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE) may be provided. An electronic device, in a wireless communication system, may include: a communication circuit; and at least one processor operatively connected to the communication circuit, wherein the at least one processor is configured to: receive downlink control information (DCI) from a base station; when the DCI does not include information indicating a transmitted precoding matrix indicator (TPMI), and, when a combination of one or more variables indicates a first polarization in a pre-configured table, transmit an uplink signal to the base station by using the first polarization; and, when the combination of the one or more variables indicates a second polarization in the pre-configured table, transmit the uplink signal to the base station by using the second polarization, wherein the one or more variables include at least one of an antenna module, an operating band, or a channel which is used for transmitting the uplink signal.

公开(公告)号：US20240014544A1

公开(公告)日：2024-01-11

申请号：US18470038

申请日：2023-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil JEON ,  Namwoo KIM ,  Seongbeom HONG ,  Kyunghoon MOON ,  Yunbum LEE

IPC: H01Q1/24 ,  H04M1/02 ,  H01Q21/06

CPC classification number: H01Q1/243 ,  H04M1/0277 ,  H04M1/0266 ,  H01Q21/065

Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

公开(公告)号：US20210249751A1

公开(公告)日：2021-08-12

申请号：US17162110

申请日：2021-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunbum LEE ,  Seongbeom HONG ,  Kyunghoon MOON ,  Seunggil JEON ,  Jaeyoung HUH ,  Jinsang KIM ,  Sungchul PARK

IPC: H01Q1/02 ,  H01Q21/08 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

公开(公告)号：US20230145636A1

公开(公告)日：2023-05-11

申请号：US18093060

申请日：2023-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghan SEO ,  Jaehoon SONG ,  Yunbum LEE ,  Janghoon HAN ,  Dongil SON

IPC: H01Q21/24 ,  H01Q9/04 ,  H01Q1/24

CPC classification number: H01Q21/24 ,  H01Q9/045 ,  H01Q1/243

Abstract: A disclosed electronic device includes a wireless communication circuit and a plurality of antenna elements. Each of the plurality of antenna elements may include: a first feeder arranged at a first point on a first virtual line, a second feeder arranged at a second point on a second virtual line perpendicular to the first virtual line, and a third feeder arranged at a third point on a third virtual line. The first, second, and third feeders may be connected to the wireless communication unit via first, second, and third electrical paths, respectively. The device may further include a switch arranged on the first electrical path, the second electrical path, and the third electrical path, and configured to electrically connect or disconnect the first feeder, the second feeder, and the third feeder to the wireless communication circuit.

公开(公告)号：US20210305739A1

公开(公告)日：2021-09-30

申请号：US17250491

申请日：2019-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon GHIM ,  Jeongho KANG ,  Youngmin LEE ,  Yunbum LEE ,  Seongbeom HONG

IPC: H01R12/79 ,  H01P3/08 ,  H04B1/00 ,  H04M1/02

Abstract: The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

公开(公告)号：US20180241369A1

公开(公告)日：2018-08-23

申请号：US15899121

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon GHIM ,  Jeongho KANG ,  Namwoo KIM ,  Yunbum LEE ,  Haimin LEE

IPC: H03H7/46 ,  H04B1/00 ,  H04B1/28 ,  H04B1/403 ,  H04W72/04 ,  H04W8/00 ,  H04W88/02

Abstract: A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.