公开(公告)号：US12051629B2

公开(公告)日：2024-07-30

申请号：US16825512

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwa Hyun ,  Younghwan Kim ,  Hwayoung Park ,  Youngsu Ryu ,  Yusang Cheon

IPC: H01L21/66 ,  B05D1/00 ,  G01N21/95 ,  G03F7/16 ,  H01L21/67

CPC classification number: H01L22/12 ,  B05D1/005 ,  G01N21/9503 ,  G03F7/162 ,  H01L21/67023

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.

公开(公告)号：US20210066140A1

公开(公告)日：2021-03-04

申请号：US16825512

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwa Hyun ,  Younghwan Kim ,  Hwayoung Park ,  Youngsu Ryu ,  Yusang Cheon

IPC: H01L21/66 ,  B05D1/00 ,  G03F7/16 ,  G01N21/95 ,  H01L21/67

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.