公开(公告)号：US12218148B2

公开(公告)日：2025-02-04

申请号：US17512126

申请日：2021-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongyun Kim ,  Hosuk Kang ,  Jinwoo Jung ,  Changjoon Lee ,  Tackmo Lee ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

Abstract: Provided is a display module including a glass substrate, a thin film transistor (TFT) layer provided on a front surface of the glass substrate, a driving circuit provided on a rear surface of the glass substrate and configured to drive the TFT layer, a plurality of light emitting diodes (LED) electrically connected to the TFT layer, a plurality of first connection pads provided at intervals in a portion of the front surface of the glass substrate and electrically connected to a TFT circuit provided in in the TFT layer, a plurality of second connection pads provided at intervals in a portion of the rear surface of the glass substrate and electrically connected to the driving circuit, and a plurality of side wirings extending from the lateral surface of the glass substrate to a portion of an insulating layer and extending to another portion of the insulating layer.

公开(公告)号：US20240421279A1

公开(公告)日：2024-12-19

申请号：US18813979

申请日：2024-08-23

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Changjoon LEE ,  Kyungwoon Jang ,  Yangsoo Son ,  Jeongyun Kim ,  Sungyong Min ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L25/16

Abstract: A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.