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公开(公告)号：US20240421279A1
公开(公告)日：2024-12-19
申请号：US18813979
申请日：2024-08-23
Applicant: SAMSUNG ELECTRONICS CO.,LTD.
Inventor： Changjoon LEE , Kyungwoon Jang , Yangsoo Son , Jeongyun Kim , Sungyong Min , Daesuck Hwang
Abstract: A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.
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公开(公告)号：US20210005796A1
公开(公告)日：2021-01-07
申请号：US16914863
申请日：2020-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungyong Min , Byunghoon Lee , Changjoon Lee , Kyungwoon Jang , Changkyu Chung
Abstract: A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.
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Patent Agency Ranking
公开(公告)号：US20230290919A1
公开(公告)日：2023-09-14
申请号：US18139691
申请日：2023-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu CHUNG , Sungyong Min , Kyungwoon Jang , Kwangrae Jo
IPC: H01L33/62 , H01L25/075 , H01L33/20
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/20 , H01L2933/0066
Abstract: A display module includes a substrate, a plurality of substrate electrode pads provided on the substrate, and a plurality of micro light-emitting diodes (LEDs) connected to the plurality of substrate electrode pads, where each of the plurality of substrate electrode pads includes a first region in which a plurality of contact protrusions are formed, and a second region configured to be connected with a repair micro LED.
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公开(公告)号：US20230125557A1
公开(公告)日：2023-04-27
申请号：US18088313
申请日：2022-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Donghun LEE , Sungyong Min , Youngki Jung , Bumki Baek , Changjoon Lee
IPC: H01L33/62 , H01L25/075 , H01L33/38
Abstract: A display module includes a thin film transistor (TFT) substrate including a glass substrate, a TFT layer provided on the glass substrate, and a plurality of TFT electrodes provided on the TFT layer; and a plurality of light-emitting diodes (LEDs) electrically connected to the plurality of TFT electrodes, wherein the TFT layer includes a plurality of sacrificial switching elements connected to the plurality of LEDs in parallel and configured to absorb static electricity generated at the TFT layer.
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公开(公告)号：US11417627B2
公开(公告)日：2022-08-16
申请号：US16992004
申请日：2020-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jamyeong Koo , Sungyong Min , Byunghoon Lee , Changjoon Lee , Changkyu Chung , Youngkyong Jo
IPC: H01L23/00 , H01L25/16 , H01L25/075 , H01L25/00
Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.
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公开(公告)号：US11362249B2
公开(公告)日：2022-06-14
申请号：US16991133
申请日：2020-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu Chung , Changjoon Lee , Kwangrae Jo , Sungyong Min , Wonsoon Park , Kyungwoon Jang , Daesuck Hwang
Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.
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公开(公告)号：US20210111324A1
公开(公告)日：2021-04-15
申请号：US16991133
申请日：2020-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu CHUNG , Changjoon Lee , Kwangrae Jo , Sungyong Min , Wonsoon Park , Kyungwoon Jang , Daesuck Hwang
Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.
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