公开(公告)号：US20240258292A1

公开(公告)日：2024-08-01

申请号：US18440304

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changjoon LEE ,  Kyungwoon JANG

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/03 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/03848 ,  H01L2224/08059 ,  H01L2224/08113 ,  H01L2224/16258 ,  H01L2924/12041

Abstract: A micro light emitting diode (LED) chip includes: a first semiconductor layer doped with an N-type dopant; a second semiconductor layer provided at a lower surface of the first semiconductor layer, and doped with a P-type dopant; an active layer provided between the first semiconductor layer and the second semiconductor layer, and configured to emit light; and an electrode pad provided at a lower surface of the second semiconductor layer, wherein the electrode pad may include a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.

公开(公告)号：US20220085099A1

公开(公告)日：2022-03-17

申请号：US17535800

申请日：2021-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongho SON ,  Jongsung LEE ,  Changjoon LEE

IPC: H01L27/15 ,  H01L27/02 ,  H05K9/00

Abstract: An antistatic ground circuit board and a micro light emitting diode (LED) display including same are provided. The display includes a substrate comprising a first surface oriented toward a first direction, a second surface oriented toward a second direction opposite the first direction, and a side surface oriented toward a third direction perpendicular to the first and second directions, a first circuit unit disposed on the first surface, a second circuit unit disposed on the second surface, a side circuit unit disposed on the side surface and electrically connected to the first circuit unit, a plurality of micro LED chips arranged on one surface of the first circuit unit oriented toward the first direction, and a ground circuit board disposed on the second surface to ground static electricity generated in one or more circuit units from among the first circuit unit, the second circuit unit, and the side circuit unit.

公开(公告)号：US20200152721A1

公开(公告)日：2020-05-14

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Youngjun MOON ,  Kwangrae JO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L27/32 ,  H05B33/10 ,  H05B33/08

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

公开(公告)号：US20220359574A1

公开(公告)日：2022-11-10

申请号：US17873969

申请日：2022-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Kyungwoon JANG ,  Kwangrae JO

IPC: H01L27/12 ,  H01L25/075 ,  H01L33/00

Abstract: A display module includes a glass substrate having a TFT layer and a driver circuit disposed on surfaces thereof, LEDs electrically connected to the TFT layer; first connection pads formed in an edge region of the front surface; second connection pads formed in an edge region of the rear surface; and side wirings in recessed grooves arranged at intervals on a side of the glass substrate so that the side wirings are located at concave positions from the side of the glass substrate, the side wirings electrically connecting the first and second connection pads, wherein the first and second connection pads are spaced a predetermined distance inward from the side of the glass substrate, and the recessed grooves are arranged so that opposite ends of the recessed grooves are located at positions corresponding to the first and second connection pads, respectively.

公开(公告)号：US20210066243A1

公开(公告)日：2021-03-04

申请号：US17010231

申请日：2020-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon LEE ,  Sungyong MIN ,  Changjoon LEE ,  Jamyeong KOO

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075

Abstract: A method for manufacturing a micro light emitting diode (LED) display is provided. The method includes a first operation of applying a light-to-heat conversion layer to a first surface of a carrier substrate, a second operation of forming a first adhesive layer on the light-to-heat conversion layer a third operation of aligning a plurality of micro LED chips on the first adhesive layer, a fourth operation of positioning the plurality of micro LED chips above a circuit board at a first distance, a fifth operation of radiating a laser to the plurality of micro LED chips, and a sixth operation of causing the first adhesive layer to be deformed by the light-to-heat conversion layer, so that the plurality of micro LED chips are detached from the first adhesive layer to be attached to the circuit board. Various other embodiments are possible.

公开(公告)号：US20240379923A1

公开(公告)日：2024-11-14

申请号：US18627177

申请日：2024-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghoon JUNG ,  Jinyoung KIM ,  Sungyong MIN ,  Changjoon LEE

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/46

Abstract: A display module includes: a substrate including a mounting surface and a pad electrode on the mounting surface; an inorganic light emitting element including a contact electrode corresponding to the pad electrode; a bump disposed between the pad electrode and the contact electrode to bond the pad electrode and the contact electrode, the bump being electrically connecting the pad electrode to the contact electrode; a reflective member configured to underfill the inorganic light emitting element to cover side surfaces of the inorganic light emitting element and a bottom surface of the inorganic light emitting element, and configured to reflect light; and a cover member configured to cover side surfaces of the reflective member and the mounting surface of the substrate, the cover member having a black color.

公开(公告)号：US20210136966A1

公开(公告)日：2021-05-06

申请号：US16638645

申请日：2018-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Tae JANG ,  Min PARK ,  Byung Hoon LEE ,  Youngchul LEE ,  Changjoon LEE ,  Jiyoung JANG ,  Youngjun MOON ,  Minyoung PARK ,  Jeonggen YOON ,  Won CHOI ,  Siho JANG

IPC: H05K13/04 ,  H01L33/00 ,  H05K13/02

Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

公开(公告)号：US20210135076A1

公开(公告)日：2021-05-06

申请号：US17259681

申请日：2019-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki JUNG ,  Jinho KIM ,  Dongmyung SON ,  Sangmin SHIN ,  Changjoon LEE ,  Kyungwoon JANG ,  Seongphil CHO ,  Gyun HEO ,  Soonmin HONG

IPC: H01L33/62

Abstract: A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.

公开(公告)号：US20210050336A1

公开(公告)日：2021-02-18

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong KOO ,  Sungyong MIN ,  Byunghoon LEE ,  Changjoon LEE ,  Changkyu CHUNG ,  Youngkyong JO

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

公开(公告)号：US20240421279A1

公开(公告)日：2024-12-19

申请号：US18813979

申请日：2024-08-23

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Changjoon LEE ,  Kyungwoon Jang ,  Yangsoo Son ,  Jeongyun Kim ,  Sungyong Min ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L25/16

Abstract: A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.