公开(公告)号：US20230176108A1

公开(公告)日：2023-06-08

申请号：US17816619

申请日：2022-08-01

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： SEUNGHYUN CHO ,  KWANJAI LEE ,  JAE-MIN JUNG ,  JEONG-KYU HA ,  SANG-UK HAN

IPC: G01R31/26 ,  G01R31/27 ,  H01L23/538 ,  H01L25/065 ,  H01L23/31

CPC classification number: G01R31/2644 ,  G01R31/27 ,  H01L23/5387 ,  H01L25/0657 ,  H01L23/3171 ,  H01L2225/06596

Abstract: A semiconductor package includes a base film having a first mount section, a first folding section, a second folding section, and a second mount section. A first semiconductor chip is disposed on the first mount section of the base film. A second semiconductor chip is disposed on the second mount section of the base film. Test pads are disposed on the first or second folding sections of the base film and is connected to each of the first and second semiconductor chips. Connection pads are disposed on the first or second mount sections of the base film and are connected to each of the first and second semiconductor chips. The first and second folding sections vertically overlap each other. The test pads are interposed between and buried by the first and second folding sections.