公开(公告)号：US20240170448A1

公开(公告)日：2024-05-23

申请号：US18470082

申请日：2023-09-19

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Sanghyeon Jeong ,  Youngja Kim ,  Junga Lee ,  Donguk Kwon

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/3511

Abstract: A method of manufacturing a semiconductor package includes applying a plurality of forces to a plurality of points of a semiconductor chip through a plurality of elastic members, and bonding the semiconductor chip to an object while the plurality of forces are applied to the plurality of points of the semiconductor chip through the plurality of elastic members, wherein the plurality of elastic members are configured such that the plurality of forces are different from each other, and the plurality of forces flatten the semiconductor chip.