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公开(公告)号：US20240120310A1
公开(公告)日：2024-04-11
申请号：US18202128
申请日：2023-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngja Kim
CPC classification number: H01L24/75 , B08B3/12 , H01L24/83 , H01L2224/7501 , H01L2224/75101 , H01L2224/83815 , H01L2224/83912
Abstract: A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.
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公开(公告)号：US12237297B2
公开(公告)日：2025-02-25
申请号：US18127513
申请日：2023-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junga Lee , Youngja Kim , Hyunki Kim , Youngmin Lee
Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.
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公开(公告)号：US20250046750A1
公开(公告)日：2025-02-06
申请号：US18923356
申请日：2024-10-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngja Kim
Abstract: A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.
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公开(公告)号：US12208541B2
公开(公告)日：2025-01-28
申请号：US17746454
申请日：2022-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngja Kim , Hyunggil Baek , Younhwan Shin
Abstract: A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.
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公开(公告)号：US20240207961A1
公开(公告)日：2024-06-27
申请号：US18243805
申请日：2023-09-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngja Kim
CPC classification number: B23K3/0623 , H05K3/34 , B23K2101/42
Abstract: A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.
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Patent Agency Ranking
公开(公告)号：US12154882B2
公开(公告)日：2024-11-26
申请号：US18126858
申请日：2023-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngja Kim
Abstract: A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.
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公开(公告)号：US20240293884A1
公开(公告)日：2024-09-05
申请号：US18397354
申请日：2023-12-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngja Kim , Seungyeop Oh
CPC classification number: B23K1/015 , B23K1/0016 , B23K1/20 , H01L21/56 , H01L24/81 , B23K2101/40 , H01L2224/81815
Abstract: In a method of manufacturing an electronic device, a substrate having a plurality of bonding pads formed on a first surface of the substrate is provided. Solder balls are attached on the bonding pads respectively. At least one radiant heating cover is disposed on the first surface of the substrate to cover the solder balls. The substrate on which the at least one radiant heating cover is disposed is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to form the heat transfer fluid in a vapor phase within the chamber. The solder balls are soldered by transferring heat generated when the heat transfer fluid in the vapor phase is brought to contact a surface of the radiant heating cover and condenses toward the solder balls as radiant heat emitted from the radiant heating cover.
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公开(公告)号：US20240178181A1
公开(公告)日：2024-05-30
申请号：US18504418
申请日：2023-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngja Kim
IPC: H01L23/00
CPC classification number: H01L24/81 , H01L2224/8121 , H01L2224/81815
Abstract: In a method of manufacturing an electronic device, a substrate having a plurality of mounting regions on which first electronic components and second electronic components are mounted is provided, the substrate having a first surface and a second surface opposite the first surface. First electronic components are mounted on the first surface of the board via first bumps. At least one vapor shielding cover is positioned on the first surface of the substrate to cover at least one of the first electronic components. Second electronic components are mounted on the second surface of the substrate via second bumps. The second bumps are soldered with a vapor phase reflow process and during the vapor phase reflow process, the at least one vapor shielding cover is configured to prevent a heat transfer fluid in a vapor state from moving to the at least one first electronic component covered by the at least one vapor shielding cover.
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公开(公告)号：US20240128229A1
公开(公告)日：2024-04-18
申请号：US18337860
申请日：2023-06-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byungkeun Kang , Chaein Moon , Youngja Kim , Youngmin Lee
IPC: H01L23/00
CPC classification number: H01L24/75 , H01L2224/75272 , H01L2224/75704 , H01L2224/75803 , H01L2224/75804 , H01L2924/40
Abstract: A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.
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公开(公告)号：US20240355640A1
公开(公告)日：2024-10-24
申请号：US18436934
申请日：2024-02-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngja Kim , Minwoo Jeon
IPC: H01L21/48 , B23K1/012 , B23K101/40 , H01L21/67
CPC classification number: H01L21/4853 , B23K1/012 , H01L21/4867 , H01L21/67109 , B23K2101/40
Abstract: In a method of manufacturing an electronic device, a substrate including a plurality of bonding pads on a first surface thereof is provided. Solder members are attached on the plurality of bonding pads respectively. An airflow control cover is positioned on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes that allows air to flow toward the solder members. The substrate on which the airflow control cover is positioned is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to place the heat transfer fluid in a vapor state within the chamber. The solder members are soldered by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the vapor passage holes of the airflow control cover.
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