MEMORY DEVICES
    1.
    发明申请
    MEMORY DEVICES 审中-公开

    公开(公告)号:US20200272210A1

    公开(公告)日:2020-08-27

    申请号:US16872896

    申请日:2020-05-12

    Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

    MEMORY DEVICES
    2.
    发明申请

    公开(公告)号:US20210294392A1

    公开(公告)日:2021-09-23

    申请号:US17338835

    申请日:2021-06-04

    Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

    MEMORY DEVICES
    3.
    发明申请
    MEMORY DEVICES 审中-公开

    公开(公告)号:US20190354145A1

    公开(公告)日:2019-11-21

    申请号:US16260278

    申请日:2019-01-29

    Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

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