公开(公告)号：US20240322177A1

公开(公告)日：2024-09-26

申请号：US18610821

申请日：2024-03-20

申请人： SAMSUNG SDI CO., LTD.

发明人： Hiroshi SEINO ,  Jeongchull AHN ,  Sanghyun KIM ,  Jaehyuck CHA

IPC分类号： H01M4/62 ,  H01M10/052 ,  H01M50/536

CPC分类号： H01M4/622 ,  H01M4/626 ,  H01M50/536 ,  H01M10/052

摘要： An electrode structure, including an electrode current collector including a coated portion and an uncoated portion; an electrode active material layer on the uncoated portion of the electrode current collector; a first lead electrode on the uncoated portion of the electrode current collector; a second lead electrode attached to the first lead electrode; a first adhesive layer between the first lead electrode and the electrode current collector and attaching the first lead electrode to the electrode current collector, and a second adhesive layer between the first lead electrode and the second lead electrode and attaching the second lead electrode to the first lead electrode, wherein at least one of the first adhesive layer and the second adhesive layer includes an adhesive which includes a binder and conductive particles, the binder including maleimide-modified polyolefin which includes two or more acidic functional groups.