公开(公告)号：US20220224060A1

公开(公告)日：2022-07-14

申请号：US17608533

申请日：2020-05-01

Applicant: SAMTEC, INC.

Inventor： Jonathan E. BUCK, III ,  Brandon Thomas GORE ,  Yasuo SASAKI ,  Julian J. FERRY

IPC: H01R13/6599 ,  H01R13/6587 ,  H01R13/6471

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US20240170303A1

公开(公告)日：2024-05-23

申请号：US18552463

申请日：2022-03-30

Applicant: SAMTEC, INC.

Inventor： John CORONATI ,  Marc EPITAUX ,  Brandon Thomas GORE

IPC: H01L21/60 ,  H01L21/48

CPC classification number: H01L21/60 ,  H01L21/485 ,  H01L2021/6003 ,  H01L2021/60075

Abstract: An interconnection system includes a mating substrate that is configured to be placed in electrical communication with a main board along an insertion direction so as to define a separable interface. The interconnection system is configured to align the mating substrate with the main board along first and second transverse directions that are perpendicular to each other and to the insertion direction.

公开(公告)号：US20230335960A1

公开(公告)日：2023-10-19

申请号：US17760138

申请日：2021-02-04

Applicant: SAMTEC, INC.

Inventor： Brandon Thomas GORE ,  Richard MELLITZ ,  Gauss YANG ,  Kelly GARRISON ,  Norman S. MCMORROW

IPC: H01R25/00 ,  H01R12/75 ,  H01R12/72 ,  G01R31/28

CPC classification number: H01R25/003 ,  H01R12/75 ,  H01R12/722 ,  G01R31/2896 ,  H01R2201/20

Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.

公开(公告)号：US20210194164A1

公开(公告)日：2021-06-24

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc EPITAUX ,  Eric J. ZBINDEN ,  John CORONATI ,  Jignesh H. SHAH ,  Brandon Thomas GORE

IPC: H01R12/73 ,  H01L23/498 ,  H01R13/506 ,  H01R13/631 ,  H05K1/18 ,  H05K1/11 ,  G02B6/42

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.