公开(公告)号：US20210194164A1

公开(公告)日：2021-06-24

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc EPITAUX ,  Eric J. ZBINDEN ,  John CORONATI ,  Jignesh H. SHAH ,  Brandon Thomas GORE

IPC: H01R12/73 ,  H01L23/498 ,  H01R13/506 ,  H01R13/631 ,  H05K1/18 ,  H05K1/11 ,  G02B6/42

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.

公开(公告)号：US20250054929A1

公开(公告)日：2025-02-13

申请号：US18722873

申请日：2022-12-22

Applicant: SAMTEC, INC.

Inventor： Marc EPITAUX ,  John CORONATI

IPC: H01L25/16 ,  G02B6/42 ,  H01L23/00 ,  H01L23/44 ,  H01L23/498

Abstract: An optical engine having an optically transparent substrate with a lens on a first major surface and an optoelectronic element on an opposed second major surface is described. The optical engine has a sealed optical path and is capable of operating submerged in a cooling liquid. The optical engine may be attached to a mounting substrate to form an optoelectronic subassembly that may be incorporated in many different types of optical interconnects.

公开(公告)号：US20240170303A1

公开(公告)日：2024-05-23

申请号：US18552463

申请日：2022-03-30

Applicant: SAMTEC, INC.

Inventor： John CORONATI ,  Marc EPITAUX ,  Brandon Thomas GORE

IPC: H01L21/60 ,  H01L21/48

CPC classification number: H01L21/60 ,  H01L21/485 ,  H01L2021/6003 ,  H01L2021/60075

Abstract: An interconnection system includes a mating substrate that is configured to be placed in electrical communication with a main board along an insertion direction so as to define a separable interface. The interconnection system is configured to align the mating substrate with the main board along first and second transverse directions that are perpendicular to each other and to the insertion direction.

公开(公告)号：US20210215897A1

公开(公告)日：2021-07-15

申请号：US16967493

申请日：2019-02-05

Applicant: SAMTEC, INC.

Inventor： Marc EPITAUX ,  John CORONATI

IPC: G02B6/43 ,  G02B6/42

Abstract: Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.