公开(公告)号：US20210315121A1

公开(公告)日：2021-10-07

申请号：US17265413

申请日：2019-08-02

Applicant: SAMTEC, INC.

Inventor： R. Brad BETTMAN ,  Josue Alfredo CARMONA ARAYA ,  John Lawrence NIGHTINGALE ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H05K7/14 ,  H05K7/20

Abstract: A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.