公开(公告)号：US20190305482A1

公开(公告)日：2019-10-03

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/627 ,  G02B6/42

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

公开(公告)号：US20240063585A1

公开(公告)日：2024-02-22

申请号：US18260024

申请日：2021-12-30

Applicant: SAMTEC, INC.

Inventor： Jignesh H. SHAH ,  Gustavo BLANDO ,  Jean Karlo WILLIAMS BARNETT

IPC: H01R13/6591 ,  H01R12/71 ,  H01R13/6463 ,  H01R13/6471

CPC classification number: H01R13/65912 ,  H01R12/716 ,  H01R13/6463 ,  H01R13/6471

Abstract: An electrical connector includes a connector housing and a plurality of electrical contacts supported by the connector housing. The electrical contacts are oriented oblique to a mounting interface of the connector housing that mounts to an underlying substrate. The electrical connector can further include a plurality of electrical cables mounted to the electrical contacts. The electrical cables can extend from the electrical contacts along a direction oblique to the mounting interface.

公开(公告)号：US20200220286A1

公开(公告)日：2020-07-09

申请号：US16604023

申请日：2018-04-10

Applicant: SAMTEC, INC.

Inventor： R. Brad BETTMAN ,  Liam PARKES ,  Eric ZBINDEN ,  Keith GUETIG ,  Jignesh H. SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Chadrick Paul FAITH ,  Edwin LOY

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/73

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

公开(公告)号：US20210315121A1

公开(公告)日：2021-10-07

申请号：US17265413

申请日：2019-08-02

Applicant: SAMTEC, INC.

Inventor： R. Brad BETTMAN ,  Josue Alfredo CARMONA ARAYA ,  John Lawrence NIGHTINGALE ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H05K7/14 ,  H05K7/20

Abstract: A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.