公开(公告)号：US20210315121A1

公开(公告)日：2021-10-07

申请号：US17265413

申请日：2019-08-02

Applicant: SAMTEC, INC.

Inventor： R. Brad BETTMAN ,  Josue Alfredo CARMONA ARAYA ,  John Lawrence NIGHTINGALE ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H05K7/14 ,  H05K7/20

Abstract: A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.

公开(公告)号：US20230387631A1

公开(公告)日：2023-11-30

申请号：US18248930

申请日：2021-10-13

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN

IPC: H01R13/639 ,  H01R43/26 ,  G02B6/42

CPC classification number: H01R13/639 ,  H01R43/26 ,  G02B6/4284

Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

公开(公告)号：US20200280145A1

公开(公告)日：2020-09-03

申请号：US16764142

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN ,  Jignesh H. SHAH

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US20160291274A1

公开(公告)日：2016-10-06

申请号：US15181762

申请日：2016-06-14

Applicant: Samtec, Inc.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: G02B6/42 ,  H04B10/40 ,  H04B10/25

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20150378116A1

公开(公告)日：2015-12-31

申请号：US14749570

申请日：2015-06-24

Applicant: Samtec, Inc.

Inventor： Eric ZBINDEN ,  John Allen MONGOLD

IPC: G02B6/42

CPC classification number: G02B6/4249 ,  G02B6/3879 ,  G02B6/3897 ,  G02B6/4269 ,  G02B6/4292

Abstract: A system includes a substrate including a first row of first receptacles, a cradle including an opening and a spring member, connectors located within the opening, and cables connected to the connectors. The cradle is configured to connect each of the connectors simultaneously or nearly simultaneously to a corresponding first, and the spring member pushes on the connectors with a force greater than an insertion force of the first receptacle.

Abstract translation: 一种系统包括：基板，包括第一排第一插座，支架，包括开口和弹簧构件，位于开口内的连接器以及连接到连接器的电缆。 支架被构造成将每个连接器同时或几乎同时地连接到相应的第一个，并且弹簧构件以大于第一容器的插入力的力推动连接器。

公开(公告)号：US20190305482A1

公开(公告)日：2019-10-03

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/627 ,  G02B6/42

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

公开(公告)号：US20140286646A1

公开(公告)日：2014-09-25

申请号：US14295367

申请日：2014-06-04

Applicant: Samtec, Inc.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: H04B10/40

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Abstract translation: 互连系统包括第一电路板，连接到第一电路板的第一和第二连接器，以及收发器，包括光引擎，并被布置成通过电缆接收和发送电信号和光信号，以将从电缆接收的光信号转换为 电信号，以及将从第一连接器接收的电信号转换为通过电缆传输的光信号。 收发器布置成与第一和第二连接器配合，使得至少一些转换的电信号被传输到第一连接器，使得从电缆接收的至少一些电信号被传送到第二连接器。

公开(公告)号：US20230393355A1

公开(公告)日：2023-12-07

申请号：US18248944

申请日：2021-10-13

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN ,  John A. MONGOLD

IPC: G02B6/42

CPC classification number: G02B6/4261 ,  G02B6/4244 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/428

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

公开(公告)号：US20160269118A1

公开(公告)日：2016-09-15

申请号：US15157548

申请日：2016-05-18

Applicant: Samtec, Inc.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: H04B10/40 ,  H04B10/27

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20130148973A1

公开(公告)日：2013-06-13

申请号：US13758464

申请日：2013-02-04

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: H04B10/40 ,  H04B1/38

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

Abstract translation: 一种互连系统，包括主机电路板; 连接到主机电路板并包括第一连接器，IC电路板和IC管芯的IC封装; 以及收发器，布​​置成与第一连接器配合，使得至少一些传输到IC芯片的电信号仅在IC电路板上或通过IC电路板传输。