公开(公告)号：US20220007514A1

公开(公告)日：2022-01-06

申请号：US17295015

申请日：2019-11-27

Applicant: SAMWON ACT CO., LTD.

Inventor： Kyung Yul LEE ,  Kwang Jong CHOI ,  Pyoung Woo LEE ,  Doo Yul BAEK

IPC: H05K3/02 ,  H05K1/03

Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).