公开(公告)号：US20250106980A1

公开(公告)日：2025-03-27

申请号：US18725768

申请日：2022-02-25

Applicant: SANECHIPS TECHNOLOGY CO., LTD.

Inventor： Qiang JIANG ,  Leqi LI ,  Zongwei WANG ,  Jian PANG ,  Tuobei SUN

IPC: H05K1/02 ,  H05K1/11

Abstract: The embodiments of the present application relate to the technical field of integrated circuit packaging. Provided are a packaging structure and an integrated circuit board. The packaging structure includes: a substrate having a plurality of first conductive layers and a plurality of second conductive layers, where the first conductive layers and the second conductive layers have different electric property types; a redistribution structure including redistribution layers at a plurality of layers and arranged at intervals, wherein the redistribution layers located at the same layer have the same electric property type, and the redistribution layers located at adjacent layers have different electric property types; and a plurality of conductive bumps electrically connected to the first conductive layers or the second conductive layers through the redistribution structure.