公开(公告)号：US20140077354A1

公开(公告)日：2014-03-20

申请号：US14092322

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Tetsuya YAMAMOTO ,  Ryosuke USUI

IPC: H01L23/367

CPC classification number: H01L23/3675 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/13062 ,  H01L2924/13091 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader.

Abstract translation: 半导体模块具有与第一基板相对设置的第一基板和第二基板。 提供第一半导体元件，使得第一半导体的高热主面面向第二基板，并且经由布线层热连接到第二基板。 提供第二半导体元件，使得第二半导体的高热主面面向第一基板，并且经由另一布线层热连接到第一基板。 第一半导体元件的发射电极和第二半导体元件的集电极通过散热器彼此电连接。