公开(公告)号：US11618707B2

公开(公告)日：2023-04-04

申请号：US16459914

申请日：2019-07-02

Applicant: SCHOTT AG

Inventor： Fabian Wagner ,  Volker Plapper ,  Andreas Ortner ,  Simon Schmitt ,  Frank-Thomas Lentes ,  Albrecht Seidl ,  Antal Makacs ,  Patrick Bartholome

IPC: B23K26/53 ,  C03B33/02 ,  B23K26/00 ,  B23K103/00

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σB) for separating the substrate along the separation line is smaller than a first reference stress (σR1) of the substrate and such that an edge strength σK of the separation edge obtained after separation is greater than a second reference stress (σR2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.