公开(公告)号：US09345129B2

公开(公告)日：2016-05-17

申请号：US14326729

申请日：2014-07-09

Applicant: SEIKO EPSON CORPORATION

Inventor： Hidetaka Saito

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0269 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/09918 ,  H05K2201/10121 ,  H05K2203/166

Abstract: A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.

Abstract translation: 其中多个基板彼此电连接的安装结构包括具有通过部分地切除第一端子而形成的第一对准标记的第一基板和具有通过部分地切除第二端子而形成的第二对准标记的第二基板 。 第一端子和第二端子通过相对于彼此相对定位而彼此电连接。