公开(公告)号：US11877387B2

公开(公告)日：2024-01-16

申请号：US17317150

申请日：2021-05-11

Applicant: Schmoll Maschinen GmbH

Inventor： Markus Winterschladen ,  Abdullah Taymuree ,  Peter Knief

IPC: H05K1/02 ,  G01N23/083 ,  G06T7/00 ,  H05K3/00

CPC classification number: H05K1/0269 ,  G01N23/083 ,  G06T7/0004 ,  H05K3/0008 ,  H05K3/0047 ,  G06T2207/30141 ,  G06T2207/30164 ,  H05K2201/09918

Abstract: The present disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool, in particular a drilling station for machining at least one circuit board, as well as to a method for controlling or identifying a platelike workpiece (1). The machining station has at least one X-ray radiation source (3), at least one detector (4) and a table (2) that can be positioned between the X-ray radiation source (3) and the detector (4), on which the workpiece (1) to be machined can be fastened. The table (2) has a receiving plate (6) made out of a material permeable to X-rays (5), in particular a plastic. The receiving plate (6) has at least one suction port (11) for extracting air and a distribution grid, which is connected in terms of flow with the at least one suction port (11) and consists of several channels (10) unilaterally open in a support surface (9) with beveled and/or rounded edges (13) and/or of inclinedly running through openings (14).

公开(公告)号：US20190174662A1

公开(公告)日：2019-06-06

申请号：US16258817

申请日：2019-01-28

Applicant: CKD Corporation

Inventor： Takahiro Ninomiya ,  Kensuke Takamura ,  Nobuyuki Umemura

IPC: H05K13/08 ,  H05K13/04 ,  H05K3/00 ,  G01N21/84 ,  H05K1/02

CPC classification number: H05K13/081 ,  G01N21/84 ,  H05K1/0269 ,  H05K3/0044 ,  H05K13/04 ,  H05K2201/09009 ,  H05K2201/09918

Abstract: A substrate position detection device includes: an irradiator that irradiates a predetermined range of a substrate with a predetermined light; an imager that takes an image of the predetermined range of the substrate irradiated with the predetermined light; a moving mechanism that causes a relative movement of the imager and the substrate; and a controller that: detects a position of the substrate by sequentially executing to a plurality of recognition objects on the substrate: a moving process of relatively moving the imager to a position corresponding to a predetermined recognition object among the plurality of recognition objects on the substrate; an imaging process of taking an image of the predetermined recognition object under a predetermined imaging condition; and a recognition process of recognizing the predetermined recognition object based on image data obtained by the imaging process.

公开(公告)号：US20180110125A1

公开(公告)日：2018-04-19

申请号：US15846450

申请日：2017-12-19

Applicant: Japan Display Inc.

Inventor： Hideaki ABE ,  Yasushi NAKANO ,  Hitoshi KAWAGUCHI ,  Ryouhei SUZUKI

IPC: H05K1/18 ,  H01R12/62 ,  H01R4/04 ,  H05K1/11 ,  G02F1/1345 ,  G02F1/1362

CPC classification number: H05K1/189 ,  G02F1/1345 ,  G02F1/136286 ,  H01R4/04 ,  H01R12/62 ,  H01R2107/00 ,  H05K1/118 ,  H05K3/323 ,  H05K3/3442 ,  H05K3/361 ,  H05K2201/09663 ,  H05K2201/09918 ,  H05K2201/10136

Abstract: Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.

公开(公告)号：US20170318680A1

公开(公告)日：2017-11-02

申请号：US15654977

申请日：2017-07-20

Applicant: Konrad GmbH

Inventor： Michael Konrad ,  Stefan Werner

IPC: H05K3/00

CPC classification number: H05K3/0008 ,  H05K2201/09918 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/53261

Abstract: In a device for producing and/or processing a workpiece, in particular circuit boards, in a work station, in particular for printing a corresponding blank or for checking finished circuit boards, at least one mark is provided on the workpiece. In this arrangement, at least one reference, which can be brought into alignment with the mark, is provided in the work station.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

Applicant: Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

Inventor： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC classification number: H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract translation: 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

公开(公告)号：US09556510B2

公开(公告)日：2017-01-31

申请号：US15076236

申请日：2016-03-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mikhail L. Pekurovsky ,  Ann M. Gilman ,  Daniel J. Theis

IPC: H05K3/16 ,  C23C14/34 ,  B41F33/00 ,  B05D1/28 ,  B05D3/06 ,  B05D3/00 ,  B41F3/00 ,  H05K13/00 ,  B41F9/10 ,  B41M3/00 ,  B41F31/00 ,  B41F31/02 ,  B41F31/04 ,  H05K1/02 ,  H05K3/12 ,  H05K3/46 ,  H05K1/03 ,  H05K3/24

CPC classification number: B41F33/0081 ,  B05D1/28 ,  B05D3/007 ,  B05D3/067 ,  B41F3/00 ,  B41F9/1063 ,  B41F31/008 ,  B41F31/02 ,  B41F31/04 ,  B41M3/008 ,  C23C14/34 ,  H05K1/0269 ,  H05K1/0283 ,  H05K1/0393 ,  H05K3/1275 ,  H05K3/16 ,  H05K3/246 ,  H05K3/4679 ,  H05K13/0015 ,  H05K2201/09918 ,  H05K2203/0143 ,  H05K2203/1344 ,  H05K2203/1545 ,  H05K2203/166

Abstract: A method of achieving precision registration in a roll to roll process by simultaneously depositing multiple inks onto a printing roll. One of these inks prints a pattern of fiducial marks onto a substrate while another ink prints a predetermined pattern on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks.

Abstract translation: 一种通过将多种油墨同时沉积到印刷辊上来实现辊轧工艺精密配准的方法。 这些墨水中的一种将基准标记的图案打印到基板上，而另一墨水在同一基板上印刷预定图案，使得预定图案与基准图案的图案具有可预测的空间关系。 因此，即使形成预定图案的墨水是不可见的，或者具有如此低的对比度，使得它在实际上是不可见的，或者甚至已经在随后的处理步骤中被溶解掉，则仍然可以知道预定图案在哪里 通过参考基准标记的模式。

公开(公告)号：US20160323992A1

公开(公告)日：2016-11-03

申请号：US15138116

申请日：2016-04-25

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird

IPC: H05K1/02 ,  H05K1/11 ,  G02B6/12 ,  H05K1/09 ,  G02B6/122 ,  G02B6/136 ,  H05K1/03 ,  H01P3/08

CPC classification number: H05K1/0274 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/1221 ,  G02B6/124 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4269 ,  G02B2006/12035 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12164 ,  H01P3/081 ,  H05K1/0201 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/024 ,  H05K1/028 ,  H05K1/032 ,  H05K1/09 ,  H05K1/115 ,  H05K3/323 ,  H05K3/4605 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/09918

Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.

Abstract translation: 印刷电路板可以包括包含AIN薄膜和作为AIN薄膜的载体衬底的高频聚合物层的氮化铝（AlN）衬底。 AIN衬底形成印刷电路板的第一层。 AIN衬底包括散热器，其横向散布来自印刷电路板上的散热器的热量，以形成与印刷电路板上的信号路径平行的散热路径。 印刷电路板可以包括与AIN衬底对准并与其结合的主衬底。 主衬底可以包括印刷电路板的一个或多个附加层。

公开(公告)号：US09345129B2

公开(公告)日：2016-05-17

申请号：US14326729

申请日：2014-07-09

Applicant: SEIKO EPSON CORPORATION

Inventor： Hidetaka Saito

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0269 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/09918 ,  H05K2201/10121 ,  H05K2203/166

Abstract: A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.

Abstract translation: 其中多个基板彼此电连接的安装结构包括具有通过部分地切除第一端子而形成的第一对准标记的第一基板和具有通过部分地切除第二端子而形成的第二对准标记的第二基板 。 第一端子和第二端子通过相对于彼此相对定位而彼此电连接。

公开(公告)号：US20160105953A1

公开(公告)日：2016-04-14

申请号：US14971688

申请日：2015-12-16

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Nikolai HASLEBNER ,  Markus LEITGEB ,  Michael GOESSLER ,  Mike MORIANZ

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0266 ,  H01L2224/2518 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/115 ,  H05K1/14 ,  H05K1/18 ,  H05K1/182 ,  H05K1/189 ,  H05K3/36 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0355 ,  H05K2201/058 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166 ,  Y10T29/49126

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract translation: 对于用于制造由多个电路板区域组成的电路板的方法，其中各个电路板区域包括至少一层由绝缘基材制成的层和位于基材上或其中的导电图案，下列 提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分重叠 所述第一电路板，所述附加电路板区域相对于所述对准标记定向，以及所述第一电路板区域和所述至少一个附加电路板区域的导电图案的多个连接。 因此，当电路板区域耦合时，可以实现改进的配准和取向。

公开(公告)号：US09301387B2

公开(公告)日：2016-03-29

申请号：US13774655

申请日：2013-02-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sang Ryou

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/02 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918 ,  Y10T29/49117

Abstract: A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs. The sawing line disposed among the dummy unit PCBs is formed with a conductive pad including a first layer formed with a PSR (Photo Solder Resistor) and a second layer on which the PSR is removed to open the conductive pad. Burr generation on the unit PCBs during a sawing process is prevented and a dummy area can be reduced.

Abstract translation: 根据本公开的示例性实施例的PCB包括排列在PCB上的多个单元PCB以及在多个单元PCB之间形成的锯线。 设置在虚拟单元PCB之间的锯线形成有导电焊盘，该导电焊盘包括由PSR（光电焊料电阻器）形成的第一层和去除了PSR以打开导电焊盘的第二层。 在锯切过程中防止在单元PCB上的毛刺产生，并且可以减少虚拟区域。