公开(公告)号：US20200277701A1

公开(公告)日：2020-09-03

申请号：US16802937

申请日：2020-02-27

Applicant: Seiko Epson Corporation

Inventor： Kenji OTSUKA ,  Kazuhiro GOMI

IPC: C23C16/455 ,  C23C16/02 ,  C23C16/56 ,  C23C16/44

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

公开(公告)号：US20210404063A1

公开(公告)日：2021-12-30

申请号：US17471230

申请日：2021-09-10

Applicant: Seiko Epson Corporation

Inventor： Kenji OTSUKA ,  Kazuhiro GOMI

IPC: C23C16/455 ,  C23C16/02 ,  C23C16/44 ,  C23C16/56

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

公开(公告)号：US20170334207A1

公开(公告)日：2017-11-23

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US20170113462A1

公开(公告)日：2017-04-27

申请号：US15299899

申请日：2016-10-21

Applicant: SEIKO EPSON CORPORATION

Inventor： Wataru TAKAHASHI ,  Yasuhide MATSUO ,  Kenji OTSUKA

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14233 ,  B41J2/1433 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1646 ,  B41J2202/11

Abstract: A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

公开(公告)号：US20150239223A1

公开(公告)日：2015-08-27

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B32B37/12 ,  B32B37/18 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Abstract translation: 接合方法包括将包括热固性树脂的接合材料施加到构件的工艺。 接合材料包括加成型有机硅树脂。 接合材料包括从由甲基的有机硅树脂，苯基类有机硅树脂和改性的有机硅树脂组成的组中选择的一种或多种。