公开(公告)号：US20180079209A1

公开(公告)日：2018-03-22

申请号：US15694125

申请日：2017-09-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Yasuhide MATSUO

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/14233 ,  B41J2/1606 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2002/14419 ,  B41J2002/14491

Abstract: Provided is a liquid ejecting head including: a first substrate in which a space serving as a flow path is formed in a state of having an opening on a surface of one side thereof; and a second substrate which seals the opening from the surface on the one side of the first substrate, divides the flow path, and is made of resin, in which the first substrate and the second substrate adhere to each other via a first adhesive layer which is laminated on the surface on the one side of the first substrate and which is made of a silicone-based adhesive and a second adhesive layer which is laminated on the first adhesive layer and which is made of an epoxy-based adhesive.

公开(公告)号：US20170334207A1

公开(公告)日：2017-11-23

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US20170113462A1

公开(公告)日：2017-04-27

申请号：US15299899

申请日：2016-10-21

Applicant: SEIKO EPSON CORPORATION

Inventor： Wataru TAKAHASHI ,  Yasuhide MATSUO ,  Kenji OTSUKA

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14233 ,  B41J2/1433 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1646 ,  B41J2202/11

Abstract: A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

公开(公告)号：US20150239223A1

公开(公告)日：2015-08-27

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B32B37/12 ,  B32B37/18 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Abstract translation: 接合方法包括将包括热固性树脂的接合材料施加到构件的工艺。 接合材料包括加成型有机硅树脂。 接合材料包括从由甲基的有机硅树脂，苯基类有机硅树脂和改性的有机硅树脂组成的组中选择的一种或多种。