公开(公告)号：US10189259B2

公开(公告)日：2019-01-29

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US09789691B2

公开(公告)日：2017-10-17

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/15 ,  B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.